Copper Diamond Heat Sink

The ideal material working as heat sink and heat spreader should have a low coefficient of thermal expansion cte and a high thermal conductivity.

Copper diamond heat sink.

A 2000 w m k diamond heat spreader can dissipate 110w heating power hotspot heat flux of 10 2kw cm 2 while maintaining the maximum hotspot temperature. Applied diamond can build heat spreaders for the most extreme possibilities. Since its reorganization in 2001 sumitomo electric u s a. Cvd diamond heat spreaders and cu heat sinks are crucial components for efficient heat dissipation in high power electronics and photonics.

Has been a sales and marketing company serving various industries and markets in north america and responsible for new products of sei group companies as well as the following products already in the market. Also the conductivity of diamond doesn t mean that it will release its heat faster than say copper it would be like aluminum and just soak up the heat without doing much to dissipate it. Etched copper and aluminum heatsinks aluminum heatsinks etched up to 080 copper heatsinks etched up to 063 full suite of secondary operations available component side flat heatsinks for printed circuit board pcb assemblies are often used in applications where ambient heat could affect the performance or cause the failure of critical electronic systems. Aluminum silicon carbide.

As a material diamond has no peer as a semiconductor medium. The two components were bonded by a multi layer ag in. As heat spreaders and heat sink 1 6. Most fundamental necessities in the development of semiconductor devices is the need to dissipate the large amounts of heat that is generated during operation of such devices.

The unsurpassed thermal conductivity of diamond and its high electrical resistivity allow for better performance across virtually. 0 1000 to 0 5000 mm. It is known from former experiments that there is a very weak bonding between as received diamonds and pure copper matrix in the consolidated composite. Sumitomo electric has successfully developed a variety of heat sink materials with high thermal conductivity and a unique.

For the chip to dissipate 70w heat power diamond heat spreaders with thermal conductivities of 2000 w m k and 1500 w m k can reduce the maximum hotspot temperature 40 and 38 respectively. Diamond in any cooling application would be best used as an interface between the source and the dissipation medium this case the heatsink not. Copper as it has the highest ther mal conductivities in metal has been used for decades as the material of choice as heat sink for semiconductor. Copper cu diamond d composites have excellent thermal property but are hard to manufacture with conventional methods.